ANALYSIS AND CONTROL OF HEAT FLOW OF SWITCHING DEVICES IN HEAT SINK ENVIRONMENT: A CONSIDERATION OF HEAT SINK STRUCTURES

C.K. Okoro, O.A. Nwaorgu, K.O. Odo, O. Yerima, P.C. Chikelu, N.D. Kanu

Abstract


The issues of overheating of electronic components especially switching devices and the inability for heat sink to adequately contain this thermal effect has posed a lot of problems in most electrical design. Design of electronic components can be achieved by proper design of heat sink environments. This study has considered various heat sink structures, its composition and also analyzed the effects of rectifier diode resistance on heat generation. Matlab/Simulink was used as an analysis tool to design as well as structure most heat sink type based on their structure shape and composition, a steady and transient model was described using Matlab/Simulink. The result of this study revealed that the circular cylindrical plate with insulation has the highest heat absorption of 500 Joules whereas thin plate with and without insulation recorded the lowest value of 200 Joules. The heat absorption capacity decreases and the highest zones of the heat sinks are less cooled. The result presented in this study showed that heat absorption can be increased in any material by deciding on the type of heat sink structure needed. According to the steady and transient analysis conducted, the surface temperature will always be an inconvenient since it is not a constant value. It changes along the plate surface and along the fin surfaces. Long heat sinks tend to have a great variance in their surface temperature.

 

KEYWORDS:  Heat sinks, switching devices, heat flow, transient model, steady model.


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References


Balachandran, R and VijayaKumari, A.(2019). Thermal analysis for optimized selection of cooling techniques for SiC devices in high frequency switching applications Thermal analysis for optimized selection of cooling techniques for SiC devices in high frequency switching applications. https://doi.org/10.1088/1757-899X/577/1/012143

Ka, M and Frede, B. (2012).The Impact of Power Switching Devices on the Thermal Performance of a 10 MW Wind NPC Converter. Energies, 5, 2559 – 2577; https://doi.org/10.3390/en5072559

Dolente, A. (2007). Analysis of the Heatsink Influence on Conducted and Radiated Electromagnetic Interference in Power Electronic Converters, in 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).

Ekpu, M. (2018).Effect of Fins Arrangement on Thermal Performance in Microelectronics Devices. J. Appl. Sci. Environ. Manage., Vol. 22 (11) 1797–1800. DOI:https://dx.doi.org/10.4314/jasem.v22i11.14

Ekpu, M., Ogbodo, E. A., Ngobigha, F., and Njoku, J. E. (2022).Thermal Effect of Cylindrical Heat Sink on Heat Management in LED Applications.1–13.

Gess, J. (2019). An abstract of the thesis of thermal control of heat sink, International Journal of Heat and Mass Transfer, vol. 52, pp. 4592-4603.

Joaquim G. C. (2011). Heat Sink Analytical Modeling.Master thesis.

John, M. and Shankar, K. (2022).A Review on Transient Thermal Management of Electronic

Devices. Journal of Electronic Packaging, Vol. 144 / 010801-1

Jung, D., Jang, H., Won, J., Cho, D., and Kwon, S. (2022). Switching and Heat-dissipation Performance Analysis of an LTCC-based Leadless Surface Mount Package. 22(1), 1–9.

Künzi, R. (2008.). "Thermal Design of Power Electronic Circuits", International Journal of Heat and Mass Transfer, vol. 51, pp. 4788-4796.

Li, Y. (2023). Design and topology optimization of heat sinks for the cooling of electronic devices with multiple heat sources, Applied Thermal Engineering, vol. 138, pp. 254-263.

Sarkar, A., and Issac, B. (2016). Importance of thermal radiation from heat sink in cooling of three phase PWM inverter kept inside an evacuated chamber.Engineering Science and Technology, an International Journal. https://doi.org/10.1016/j.jestch.2016.06.004

Seshasayee, N. (2011) .Understanding Thermal Dissipation and Design of a Heatsink, Journal of Mechanical Design, vol. 137, no. 11.


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